GaN-HEMT空气桥技术研究的开题报告.docx
上传人:王子****青蛙 上传时间:2024-09-15 格式:DOCX 页数:2 大小:10KB 金币:10 举报 版权申诉
预览加载中,请您耐心等待几秒...

GaN-HEMT空气桥技术研究的开题报告.docx

GaN-HEMT空气桥技术研究的开题报告.docx

预览

在线预览结束,喜欢就下载吧,查找使用更方便

10 金币

下载此文档

如果您无法下载资料,请参考说明:

1、部分资料下载需要金币,请确保您的账户上有足够的金币

2、已购买过的文档,再次下载不重复扣费

3、资料包下载后请先用软件解压,在使用对应软件打开

AlGaN/GaNHEMT空气桥技术研究的开题报告Title:ResearchonAir-bridgeTechnologyforAlGaN/GaNHEMTIntroduction:AlGaN/GaNHEMT(HighElectronMobilityTransistor)isatypeofsemiconductordevicethatshowsexceptionalperformanceinhighpowerandhighfrequencyapplications.However,thedevicereliabilityisoftenaffectedbythesurfacestatesandtherelatedparasiticeffects.Theair-bridgetechnologyhasbeendevelopedtosolvethisproblembycreatinganisolationbetweenthesource/drainelectrodesandthesurfaceofthedevice.Objectives:ThemainobjectiveofthisresearchistoinvestigatetheperformanceimprovementandthereliabilityoftheAlGaN/GaNHEMTwithair-bridgetechnology.Thespecificobjectivesare:1.Tofabricatetheair-bridgeAlGaN/GaNHEMTusingstandardsemiconductorprocessingtechniques.2.TocharacterizethedeviceperformanceintermsofDCandACcharacteristics.3.Toinvestigatetheeffectofair-bridgetechnologyondevicereliabilityundervariousstressconditions.4.Tocomparetheperformanceandreliabilityoftheair-bridgeAlGaN/GaNHEMTwiththeconventionaldevice.Methods:Theresearchwillbecarriedoutinseveralsteps.First,theHEMTdevicewillbedesignedandsimulatedusingTCADsoftware.Then,thedevicewillbefabricatedusingstandardsemiconductorprocessingtechniques.Theair-bridgetechnologywillbeimplementedbyetchingatrenchbetweenthesource/drainelectrodesandthesurfaceofthedevice,followedbydepositionofadielectricmaterial.Theelectricalcharacteristicsofthedevicewillbemeasuredusingasemiconductorparameteranalyzer.Toinvestigatethereliability,thedevicewillbesubjectedtovariousstressconditions,suchastemperature,biasvoltageandcurrent,andradiation.Theperformanceoftheair-bridgeHEMTwillbecomparedwiththeconventionaldevice.Expectedresults:Theresearchisexpectedtodemonstratethefeasibilityandadvantagesofair-bridgetechnologyforAlGaN/GaNHEMT.Theresultswillshowimprovementindeviceperformanceandreliability,indicatingthepotentialfordeviceapplicationsinhighpowerandhighfrequencyelectronics.Conclusion:Theresearchonair-bridgetechnologyforAlGaN/GaNHEMTisaninnovativeapproachtoimprovedevicereliabilityandperform