La对低银无铅钎料Sn0.3Ag0.7Cupad焊点界面与性能的影响的开题报告【摘要】本文以低银无铅钎料Sn0.3Ag0.7Cu为研究对象，以焊点界面与性能为研究目标，通过对该钎料焊接试件的制备，结合各种分析测试方法，探究了焊点界面的微观结构及其对焊点性能的影响。研究结果表明，焊点界面的组织结构对焊点的各项性能都有着重要的影响，尤其是界面夹杂物和界面反应产物对焊点强度和延展性的影响最为显著。同时，钎料成分、焊接工艺等因素也对焊点界面结构及性能产生了影响。【关键词】低银无铅钎料；Sn0.3Ag0.7Cu；焊点界面；焊点性能【Abstract】Thispaperfocusesonthelowsilverlead-freesolderSn0.3Ag0.7Cuastheresearchobject,andaimstoexplorethemicrostructureofthesolderjointinterfaceanditsimpactonsolderperformance.Thepreparationofthesolderjointswascarriedout,andvariousanalyticalandtestingmethodswereemployedtostudytheinfluenceofthemicrostructureofthesolderjointinterfaceontheperformanceofthesolderpoints.Theresultsshowthattheorganizationalstructureofthesolderjointinterfacehasasignificantimpactontheperformanceofthesolderjoints,especiallytheinterfaceinclusionsandinterfacereactionproductshavethemostsignificantinfluenceonthesolderstrengthandductility.Meanwhile,thefactorssuchasthecompositionofthesolder,theweldingprocess,etc.alsohaveanimpactonthestructureandperformanceofthesolderjointinterface.【Keywords】Lowsilverlead-freesolder;Sn0.3Ag0.7Cu;Solderjointinterface;Solderperformance.