ATTACHMENT:SAMPLEPREPARATIONINSTRUCTIONS附件：样品准备说明General总述SAMPLEPREPARATIONPreparesamplesbysubjectingthemtoALLoperationsofthespecifiedprocess.样品准备－准备之样品必须经受所有的指定的工艺流程Includealletching,bakingandcuringsteps.包括所有蚀刻，烘烤和干燥过程。Exposethesamplestoallmaximumtimes,temperaturesandpressures.使样品经受所有的最长时间，最高温度和最大压力。Subjectsamplestothemaximumnumberofcyclesspecifiedinanystep.使样品经受任何指定步骤中的最多次循环。PartA章节ABDSAMPLES–Makecertaintheconductorpatternwhichyouusetobuildthesamplesreflectyourratingrequirements.Theseinclude:BD样品－务必确定样品的导线分布反映您所要求的等级，包括：minimumcopperthickness最小铜厚minimumconductorwidths最小导线宽度maximumunpierceddiameter最大区域直径minimumthicknessoflaminate基材最小厚度Wewillassignpatternlimitsbasedonactualmeasurementsofthetestsamples.我们将根据您所提供的测试样品的实际尺寸来标定样品规格界限。AttachmentT1,takenfromtheStandardforPrintedWiringBoards,UL796,Figure10.1,illustratesatypicaltestpattern.Thetestpatternshouldappearonbothsidesofthesamples,onesidebeingthemirrorimageoftheother.IfyoudesireRecognitionforsinglesidedprintedwiringboardsonly,thetestpatternonlyneedappearononesideofthesamples.附件T1，取自印刷线路板标准－UL796，图10.1，图示为典型的样品测试式样。若为双面板，则双面的布线式样应互为镜像。若为单面板，则仅有一面为此布线式样。Ifthemaximumunpierceddiameterwon'tfitonthetestpattern,pleaseprovideaseparatesetofsamples.Youmayetchtheseintoeitheracircleorasquare.SeeFigure10.3.若最大直径区域在附件T1样品图中无法容下，请另外准备一组体现最大直径的样品。可以蚀刻成圆形或者正方形。参见图10.3。COPPERTHICKNESSIfyouplantobuycoppercladlaminatewithaminimumcopperthicknessoflessthan34microns(1oz./squarefoot),youshouldplateyoursamplesto34micronsfortestingpurposes.铜厚－若您将要使用的覆铜基材的铜厚小于34微米，则为了测试需要，请将您的样品铜厚镀至34微米。Inproduction,ifyouplantoplatecoppertomorethan102micronsthick(3oz./squarefoot),pleaseprovideanextrasetofsamplesbuiltuptoyourmaximumcopperthickness.在实际生产中，若您使用的铜箔厚度超过102微米，请另外提供一组符合您最大铜厚的样品。MULTILAYERCONSTRUCTIONFormultilayerboards,youmustusethesameconductorpatternontheexternalandinternallayers.Positiontheunpiercedareasdirectlyovereachother.多层板结构－对于多层板，在内外层上都必须使用相同的导线分布式样。最大直径区域应互相覆盖。Werequiretheconstructionto