(JPLD-30275)SurveyofReworkMethods/EquipmentandContractManufacturersforVariousPackagingTechnologiesFY’04FinalReportAuthor:Dr.RajeshuniRameshamJetPropulsionLaboratoryTel.:8183547190,Fax:8183934382HYPERLINK"mailto:Rajeshuni.Ramesham@jpl.nasa.gov"Rajeshuni.Ramesham@jpl.nasa.govCo-author/Dr.R.DavidGerkeTaskManager:JetPropulsionLaboratoryTel.:8183936372,Fax:8183934382HYPERLINK"mailto:david.gerke@jpl.nasa.gov"david.gerke@jpl.nasa.govHYPERLINK"http://nepp.nasa.gov"http://nepp.nasa.govDate:August2005ThisbodyofworkwascarriedoutattheJetPropulsionLaboratory,CaliforniaInstituteofTechnology,underacontractwiththeNationalAeronauticsandSpaceAdministration.Referencehereintoanyspecificcommercialproduct,process,orservicebytradename,trademark,manufacturer,orotherwise,doesnotconstituteorimplyitsendorsementbytheUnitedStatesgovernmentortheJetPropulsionLaboratory,CaliforniaInstituteofTechnology.TableofContentsPageNo.TOC\o"1-3"\h\z\uHYPERLINK\l"_Toc111901725"1.AbstractPAGEREF_Toc111901725\h4HYPERLINK\l"_Toc111901726"2.ReworkofPrintedWiringBoards(PWB)andPrintedCircuitBoards(PCB)PAGEREF_Toc111901726\h4HYPERLINK\l"_Toc111901727"2.1CoplanarityPAGEREF_Toc111901727\h4HYPERLINK\l"_Toc111901728"2.2SolderPasteandPartAlignmentRework(Pre-reflow)PAGEREF_Toc111901728\h4HYPERLINK\l"_Toc111901729"2.3PartReplacementandRealignment(Post-reflow)PAGEREF_Toc111901729\h4HYPERLINK\l"_Toc111901730"2.4Reworkof0201DevicesPAGEREF_Toc111901730\h5HYPERLINK\l"_Toc111901731"2.5MicroSurfaceMountDeviceComponentReworkPAGEREF_Toc111901731\h7HYPERLINK\l"_Toc111901732"2.6BallGridArray(BGA)ReworkPAGEREF_Toc111901732\h7HYPERLINK\l"_Toc111901733"2.7PlatedThroughHole(PTH)ReworkPAGEREF_Toc111901733\h9HYPERLINK\l"_Toc111901734"2.8ElectronicSubassemblyReworkbyInfraredRadiationPAGEREF_Toc111901734\h9HYPERLINK\l"_