BridgingTheoryinPracticeAdvancedPowerDissipationandACThermalAnalysisAdvancedPowerDissipationandACThermalAnalysisAdvancedPowerDissipationandACThermalAnalysisElectricalvs.ThermalDCParametersElectricalResistancevs.ThermalResistanceElectricalCircuitsvs.ThermalCircuitsElectricalvs.ThermalParametersAdvancedPowerDissipationandACThermalAnalysisDieAttachCth3–Rth3LeadframeThermalRCNetwork-InternalThermalRCNetwork–TotalJunctionTemperatureCalculationsJunctionTemperatureCalculationsJunctionTemperatureCalculationsChipTDCJunctionTemperatureCalculationsDCJunctionTemperatureCalculationZth(j)=?Zth(t)=?ACJunctionTemperatureCalculationofTransferFunctionSimplifiedACThermalRCNetworkThenewRCcomponentvaluesofthesimplifiednetworkareobtainedbymathematicaltransformations.TheydoNOTrefertoanyphysicallayer.Together,theydescribetheoverallthermalbehaviorandperformanceofthedeviceandheatsink.SimplifiedACThermalRCNetworkACTemperatureCalculationSimplifiedTransferFunctionAdvancedPowerDissipationandACThermalAnalysisDevelopmentoftheZthDiagramZthja(C/W)ZthDiagramfortheTO-263PackageZthja(C/W)ZthDiagramsforDifferentPackagesAdvancedPowerDissipationandACThermalAnalysisPDDutyCyclePowerDissipationPD=400WThermalResistanceZthja=0.083C/WJunctionTemperatureTjunction,peak=Tambient+PDZthjaTjunction,peak=25C+(400W)(0.083C/W)Tjunction,peak=25C+33C=58CSinglePulse–TO-263PackageSaberSimulation50%DutyCycleinaTO-263PackageDutyCyclePowerDissipationPD=1.44WThermalResistanceZthja=23C/WJunctionTemperatureTjunction=Tambient+PDZthjaTjunction=25C+(1.44W)(23C/W)Tjunction=25C+33C=58CAdvancedPowerDissipationandACThermalAnalysisComplexPulse-SuperpositionMOSFETTurnOnIDSComplexPulse-SuperpositionMOSFETTurnOnComplexPulse-SuperpositionMOSFETTurnOnComplexPulse-SuperpositonMOSFETTurnOnComplexPulse-SuperpositonMOSFETTurnOnComplexPulse-SuperpositonMOSFETTurnOnAdvancedPowerDissipationandACThermalAnalysisAdvancedPowerDissipationandACThermalAnalysisThankyou!www.btipnow.com