TOYOTAENGINEERINGSTANDARDNO.:TSC0509GTITLE:Lifebenchtestmethodforsolder]ointsofautomotiveelectricandelectronicequipmentCLASS:C1Established:/Revised:Rsv.4(Nov.2020)Thisstandardhasbeenrevisedasaresultofthefollowingchanges:themethodofobservingsoldercracksinBGApackagepartshasbeenaddedandrevised[Section2(21),Table4,andFig19);andthenameofthecheckitemhasbeenchangedfromelementsizetodiesize(Table1)PreparedandWrittenby:ElectronicPerformanceDevelopment&EngineeringDept.ElectronicsControlSystemDevelopmentDiv.DesignQualityInnovationDept.TOYOTAMOTORCORPORATIONLifebenchtestmethodforsolderjointsofautomotiveelectricandelectroniceauipmentScopeThisstandardcoverstheimplementationmethodoflifebenchtestforsolderjointsofelectricandelectronicequipmentinstalledinautomobiles.ThesolderjointsofelectronicequipmentthatarespecifiedhereconformtothetermsanddefinitionsinSection2belowInthecasewherethislifetestmethodisappliedtosolderjointsotherthanthese,theconcernedpartiesshalldiscussthisseparatelyandthetestshallbecarriedoutinaccordancewiththestrengthoftherelevantjoints,thestressesthatareappliedtothosejoints,andthetargetperformanceofthecomponent.Foritemswhoseconditionsarenotspecifiedindetaithere(measurementrange.testconditions,etc.),theconditionsshallbedeterminedinconsiderationofthedesignspecificationsafteragreementwiththeconcerneddepartments.DefinitionsAutomotiveelectricandelectronicequipment(hereinafterreferredtoas"equipment")Thetermautomotiveelectricandelectronicequipmentrefersmainlytodevices(ECU)thatcontrolthesystemusingsemiconductordevicesandalsootherequipmentsuchasvariousdetectiondevices(sensors)andelectromagneticequipment(actuators)thatareusedinconjunctionwiththeECU.⑵SolderSolderisasoftmetalalloywithameltingpointoflessthan450°Cwhosemaincomponentistin(Sn).Itisusedtocreateabondbetweenmetalsandjointhemtogether.Thesolderutilizesthecapillaryactionphenomenonbetweentwometalsurfacestospreadanddistributeitself.ResincircuitboardAresincircuitboardisaresinpartintheshapeofaboardorfilmth