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FCBGABrittleSolderJointStudyAgendaProblemstatementSolderJointCrackIdentificationNiP+InterfaceofseparationisbetweenNi-Snintermetalliccompound(IMC)andNi-P+.AsdepositedNi-PlayerisamorphousTheNi-P+layerconsistsofpolycrystallineNi3PphaseandamorphousNi-P6kxmagFIB/SEMobservations:VoidsattheinterfacebetweenNi-P+layerandNi/SnintermetallicPresenceofmudflatcracksintheNi-P+layer.MudflatcracksareduetothehighstressintheNi-P+layerasaresultofincreasedPconcentrationandchangeincrystalstructure(solderingreaction-assistedcrystallization,JWJang,PGKim,KNTu,JournalofAppliedPhysics:Vol85No12,Pg8456,1999)6samplesCross-SectionofFailingLandPad(afterpeeltest)UndercutGoodJointFCBGASolderJointCrackFMFCBGASolderJointCrackFM(Con’t)BrittleSolderJointFailureRCHypothesisNiP+&IMCThicknessafterBA+1xSMT/3pTBI4-LC06.02M21201FIBSEMTOFSIMSTOFSIMSSnAlphaPO2TOFSIMSRed=InGreen=SnBlue=PbXPSAlphaSenju(A)Senju(B)XPSOtherFAtoolsKeyLearning
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