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SOP封装工艺流程介绍ContentsPackageInstructionPackageInstructionASYprocessflowWaferGrinding大家应该也有点累了,稍作休息Purpose:ToseparatediesfromeachotherfordieattachBeforewafersaw:Purpose:AttachthedieswithepoxyonsubstrateforthefollowingprocessPurpose:SolidifytheepoxyafterD/APurpose:ConnectingthechipandtheexteriorcircuitMoldMachineMoldingMoldingMoldingMoldingPurpose:UselaserlightirradiatedbyCO2orYAGtovapourtheEMCtoshowcontentonthepackage,suchasdate,schedule,placeofproductionandsoon.OvenDe-junkPlatingPlatingPurpose:Removethetie-barandlead-frameandformproductstounitsfromstrips,fillthemintotubesandthenpasstonextprocess.TrimFormQualityControlLeadFrameQualityControlQualityControlDieQualityControlQualityControlPlating